Super CMC Heat Sink for Semiconductors
High thermal conductivity and low thermal expansion semiconductor heat sink made of copper and molybdenum clad material.
We provide semiconductor heat sinks using our uniquely developed 'S-CMC'. 'S-CMC' is composed of a multilayer flat plate made of Mo foil and Cu foil, and it is a clad material with superior thermal conductivity and low thermal expansion compared to Mo powder products. It can be applied in various semiconductor fields, but it is particularly suitable as a heat sink for GaN devices used in 4G/5G communications, and it is expected to be used as a heat dissipation material for devices in mobile phone base stations for 5G communication. 【Features of S-CMC】 ■ Patents obtained in Japan, the US, China, and Europe; trademarks registered in Japan, the US, and China ■ The amount of Mo used can be freely selected according to the purpose, and it can accommodate the desired thermal expansion rate ■ Over 10 years of proven performance in satellite communication devices using GaN elements *For more details, please download the PDF or feel free to contact us.
- Company：FJコンポジット
- Price：Other
